Ericsson CFO said AI infrastructure build-out will put greater pressure on component prices in H2 2026, citing chips, ASICs, memory and other parts. The company will pursue restructuring, including layoffs, for the remainder of the year.

2026-07-14

Ericsson CFO said AI infrastructure build-out will put greater pressure on component prices in H2 2026, citing chips, ASICs, memory and other parts. The company will pursue restructuring, including layoffs, for the remainder of the year.