Researchers at the Institute of Metal Research, Chinese Academy of Sciences,
together with the Belarusian National Academy of Sciences’ Science‑Practice
Materials Research Center and Jiangxi Naile Copper Co., have developed an
electrochemical deposition additive‑manufacturing process to in‑situ grow porous
copper wicks on Omega‑channel surfaces. Atomic‑scale stacking control produces
tunable pore‑size gradients from nanometre to micrometre scales; the resulting
gradient electrochemical wick delivers roughly 2x the capillary force of
conventional copper‑powder sintered wicks and doubles single‑pipe
heat‑dissipation power versus standard grooved tubes. The method addresses
integrated manufacturing of Omega channels with graded wicks and is presented as
enabling next‑generation high‑thermal‑conductivity copper heat pipes for AI
compute‑center cooling.
