Canada national economic confidence index 52.6 through July 24, up from 51.4.

2-year (TS) most-active contract unchanged; 5-year (TF) most-active contract down 0.02%; 10-year (T) most-active contract down 0.04%; 30-year (TL) most-active contract up 0.10%.

Samsung’s semiconductor technology head said next‑generation HBM5 will use a 2nm GAA process for the base die with higher-density through‑silicon vias (TSVs) and is expected to be more than 50% faster than HBM4E. Samsung said it will leverage experience from 4nm HBM4 base dies, introduce 2nm early in HBM5 development, and expand customer engagement across mobile, AI, HPC, automotive electronics and robotics.