The Hong Kong SAR government and China’s Ministry of Industry and Information
Technology (MIIT) signed a cooperation agreement on 28 July at the SAR
government headquarters to jointly establish a national manufacturing innovation
center in Hong Kong. Hong Kong’s fiscal budget proposal has proposed reserving
funds to build the first overseas national manufacturing innovation center,
aimed at driving key technology breakthroughs, accelerating commercialization of
results and attracting international talent. The government has backed the Hong
Kong Microelectronics R&D Institute to lead operation of the center, aligning
the project with national technology and industrial priorities and leveraging
Hong Kong’s existing semiconductor ecosystem.
