The Information, citing two people familiar with the project, reports TSMC
(TSM.N) is developing an advanced chip-packaging technology similar to Intel's
(INTC.O) Embedded Multi-die Interconnect Bridge (EMIB). With AI driving demand
to integrate more processors and high-bandwidth memory into larger multi-die
packages, advanced packaging has emerged as a key industry bottleneck. Intel’s
EMIB uses small silicon bridges to create high-speed links between processors
and memory, enabling larger multi-chip AI designs and helping customers
diversify supply chains; it has attracted interest from NVIDIA (NVDA.O). Sources
say TSMC engineers internally call the work “EMIB-like” and have discussed the
solution with some customers.
