CITIC Securities research says advanced packaging will remain a primary path for
sustaining steep performance upgrades in high-end chips. Glass substrates could
relieve current advanced-packaging bottlenecks—larger panel sizes,
higher-density/high-speed upgrades and output efficiency—and may be entering an
accelerated maturity and volume ramp. The report notes clear penetration trends
and high growth elasticity for glass carrier boards and flags industry-chain
investment opportunities; glass interposers, glass carriers and glass bridges
are also seen as significant growth areas.
