ARAMCO CEO warned that the geopolitical crisis is intensifying and an unprecedented supply shock is unfolding.

U.S. President Trump said nothing can enter Iran without U.S. approval.

The 27th International Conference on Electronic Packaging Technology (ICEPT2026) will run Aug. 5-7 in Xi'an, showcasing advanced packaging equipment, materials and test solutions. With global advanced-packaging capacity tight, China’s assembly-and-test sector is launching a large-scale expansion; domestic leaders including JCET, Huatian Technology and Tongfu Microelectronics are expanding advanced-packaging capacity and prioritizing high-end memory, power semiconductors and high-performance computing packaging. The build-out is expected to deepen ecosystem coordination and accelerate domestic self-sufficiency in advanced packaging.