新西蘭第二季度勞工成本指數季率 0.7%，預期0.60%，前值0.50%。

At the Future Memory & Storage conference in Santa Clara on Aug. 4, Samsung Electronics introduced a V10 Bonding V‑NAND (BV‑NAND) prototype with more than 400 layers using a new wafer‑bonding architecture. Samsung says BV‑NAND increases storage density about 58% versus its V9 NAND while improving read, write and I/O performance to address AI system demand for higher‑capacity, more energy‑efficient memory. The company also presented concept models for zHBM and zNAND‑O that vertically stack memory on top of AI accelerators rather than beside them, shortening data paths, boosting bandwidth and improving power efficiency. Samsung says its wafer‑bonding approach could deliver more than 10x the density of conventional HBM5, roughly 3x the energy efficiency and over 50% lower thermal resistance.

Ukraine's SBU said on Aug 4 it has struck more than 100 Russian strategic targets over the past 40 days, targeting defence-industrial firms, air bases, air-defence systems, command posts, ships, 'shadow fleet' tankers, refineries, oil depots, pump stations, oil terminals and military logistics, causing damage to equipment and infrastructure. The SBU said strikes hit six military airfields, including Saky, Gvardeyskoye and Engels, and the Yevpatoria aircraft factory. Kyiv said it will continue operations to degrade Russia's military-economic capacity. Russia had no immediate comment.