Yole Group analyst Josephine Lu said at the Future Memory & Storage conference
in California on the 4th that heavy investment by Samsung Electronics and SK
Hynix will keep South Korea the global leader in memory chips through 2031.
Korea plans to double wafer capacity over the next five years, Lu said, and both
Samsung and SK Hynix are accelerating investment. Demand for high‑bandwidth
memory (HBM) is expected to expand rapidly beyond NVIDIA GPUs to in‑house AI
accelerators at large cloud and tech firms such as Google. Synchronous capacity
and R&D expansion in next‑generation DRAM (including HBM) and NAND underpins
Korea’s sustained advantage.