China International Capital Co. says acceleration in China’s PCB industry is
creating openings for domestic dry‑film manufacturers; high technical barriers
plus sustained demand underpin a long‑term investment case. CICC estimates the
photosensitive dry‑film market at $2.333 bln in 2026, rising to $3.348 bln by
2030 (CAGR 9.44%). Prismark data: global PCB market $85.8 bln in 2025 (+16.7%
YoY), about $102.0 bln this year (+19% YoY) and c.$144.6 bln by 2030. Rapid
AI-driven demand for higher‑end boards—multilayer, HDI and packaging
substrates—will lift corresponding dry‑film markets: CICC forecasts 2030 sizes
up 45.2%, 50.6% and 54.4% versus 2026, respectively.
