Beijing, Aug 14 — A seminar hosted by the China Electronic Information Industry
Development Research Institute and its AI chip evaluation/key lab said China’s
new high-compute substrate materials are at an industrialization window but face
material–equipment–process–terminal coordination gaps, missing standards and
absence of pilot production platforms. Experts flagged risk of new supply-chain
chokepoints in critical materials, specialized equipment and advanced packaging
from supply–demand mismatches and supplier concentration, and said lack of
reliability data and unified testing standards is deterring investment and
end-user adoption. They recommended strengthened capacity monitoring and early
warning, diversified supply and technical backups, cross-disciplinary joint R&D
and creation of demonstration application zones to drive scenario-led domestic
substitution and close the lab-to-line, materials-to-terminal industrial loop.
