Chinese chip-equipment supplier Minde Electronics said at an earnings briefing
it has signed contracts to expand wafer capacity to 60,000 wafers/month, with
some equipment already on-site, and is negotiating further orders to target
100,000 wafers/month. The company expects wafer-fab capacity to be materially
released from Q4 and into 1H next year, timing contingent on equipment delivery
and commissioning.
