China State Planner said the Chinese integrated circuit industry shows four
market-relevant features this year. First, key core technologies are breaking
through: high-end chip design and manufacturing capabilities are improving,
power and compound semiconductors are accelerating differentiated
competitiveness, and advanced packaging and memory are making faster progress.
Second, corporate competitiveness is strengthening: as of Aug. 27, listed
companies with disclosed results reported H1 revenue +12.8% YoY and net profit
+99% YoY; R&D spending rose 13.4% YoY. Third, investment and capacity expansion
are accelerating: IC manufacturing investment was up 11.5% YoY in the first
seven months. Fourth, capacity utilization remains high—major domestic foundries
averaged above 90% in H1 and process capacity is ramping to meet automotive- and
industrial-grade chip demand. The agency also said industry-chain security has
materially improved.