Putin said Ukraine's 40-day campaign ordered by Zelensky inflicted damage on Russia equal to about 1% of GDP, based on preliminary estimates. He said since June roughly 100 Russian vessels have been damaged, about 40 in the first two weeks, and that only about 10% of damaged refinery facilities remain to be repaired. He did not comment on strikes against Wildberries and Ozon warehouses; those attacks have already caused billions of dollars of damage to Russia's logistics network. Zelensky has th

2026-09-02

Putin said Ukraine's 40-day campaign ordered by Zelensky inflicted damage on Russia equal to about 1% of GDP, based on preliminary estimates. He said since June roughly 100 Russian vessels have been damaged, about 40 in the first two weeks, and that only about 10% of damaged refinery facilities remain to be repaired. He did not comment on strikes against Wildberries and Ozon warehouses; those attacks have already caused billions of dollars of damage to Russia's logistics network. Zelensky has threatened large-scale drone deployments to effectively close Russian commercial airspace; Putin said Russia would find a way to respond if that occurs.

其他消息
2026-09-01

國內新聞 1. 習近平出席“上海合作組織+”會議並發表重要講話。 2. 李強會見美中貿易全國委員會董事會代表團。 3. 三部門發佈《汽車行業境外競爭行爲與合規建設指引》。 4. 智神星一號成功首飛,火箭設計重複使用次數不少於25次。 5. 市場監管總局就《網絡交易小程序平臺合規指引(徵求意見稿)》公開徵求意見。 6. 財政部等兩部門:外籍個人從外商投資企業取得的股息紅利所得,按照“利息、股息、紅利所得”繳納個人所得稅,適用20%稅率。 7. 暑運期間民航累計運送旅客超1.5億人次。 國際新聞 1. 特斯拉8月歐洲市場表現分化,法國、丹麥銷量強勁,挪威、瑞典銷量下滑。 2. 據福克斯新聞:美國衆議院今天可能就一項法案進行投票,以避免政府停擺,併爲政府提供資金直至12月11日。 3. 歐元區通脹重返3%以上,進一步鞏固歐洲央行加息預期。 4. 軟銀支持的SB Energy申請IPO,瞄準AI數據中心電力需求。 5. 俄羅斯下調2026年石油產量預期至17年來最低。 6. 兩艘超級油輪在霍爾木茲海峽遭炮彈擊中。 7. 伊朗方面表示,當前局勢不允許迴歸與美國簽署的諒解備忘錄,原因是美方違反了該

2026-09-02

Deutsche Bank says a persistent 'memory wall' and tight memory supply are reshaping next‑generation AI chip roadmaps. Investors are discussing some new processors cutting HBM configurations as elevated DRAM prices are being built into AI capex calculations. Supply constraints are accelerating alternative approaches, including more SRAM‑dependent inference chips, custom HBM base dies, HBF and other HBM variants. Engineering plans remain fluid with limited supply‑chain visibility; most management