BOE Technology (BOE A) said in an investor event it invested 993 mln yuan in 2024 to build a panel-level glass packaging-substrate pilot line; main equipment was installed and debugged in 2025 and the line’s fully automated equipment was brought online in 1H 2026. The pilot line is designed for 1,000 panels/month and has validated end-to-end processes including high-aspect-ratio TGV drilling, deep-hole copper fill, low-stress metallization and routing, multi-layer lamination, high-density routin

BOE Technology (BOE A) said in an investor event it invested 993 mln yuan in 2024 to build a panel-level glass packaging-substrate pilot line; main equipment was installed and debugged in 2025 and the line’s fully automated equipment was brought online in 1H 2026. The pilot line is designed for 1,000 panels/month and has validated end-to-end processes including high-aspect-ratio TGV drilling, deep-hole copper fill, low-stress metallization and routing, multi-layer lamination, high-density routing and low-stress cutting, giving it full glass substrate manufacturing capability.