A股三大股指午後再度下探均已翻綠，光刻機、液冷服務器、半導體、CPO概念等板塊跌幅居前。

Samsung Electronics said it has opened an advanced semiconductor packaging R&D center in Yokohama, Japan. The company plans to invest about 40 bln yen over five years from 2024 to expand lab hardware and bolster advanced packaging capabilities, and will collaborate with Japanese firms, universities and research institutes to develop next‑generation packaging materials and processes. Samsung targets more than 100 researchers at the facility by 2027.

The U.S. National Transportation Safety Board (NTSB) said it will hold a media briefing at 4:00 p.m. ET on Monday regarding a runway excursion at Miami International Airport.