Sept. 7 — China International Capital Co, acting as lead underwriter and bookrunner, helped the Republic of Kazakhstan (authorized by its government and represented by the Ministry of Finance) complete a bookbuilt issuance of its second 2026 renminbi sovereign bond on China’s interbank market (Bond Connect eligible). Total size RMB 6.6 bln: 3-year tranche RMB 5.0 bln at 1.82%; 5-year tranche RMB 1.6 bln at 1.95%.

On Sep 8, turnover on the Shanghai and Shenzhen exchanges totaled CNY1.9603 tln, up CNY14.315 bn from the prior session. Shanghai turnover was CNY915.57 bn (previous CNY897.90 bn) with trading volume 530 mln lots (vs 477 mln); Shenzhen turnover was CNY1,044.77 bn (previous CNY1,048.12 bn) with volume 644 mln lots (vs 588 mln). Zhongji Xuchuang led single-stock turnover at CNY26.22 bn, followed by CATL CNY17.45 bn, Xinyisheng CNY15.58 bn, Zhaoyi Innovation CNY14.61 bn and Changxin Technology CNY11.57 bn.

獨立宏觀研究機構The Kobeissi Letter表示，散戶對半導體ETF的買入規模目前已降至低於過去一年平均水平1個標準差的位置。今年6月中旬，這一買入規模一度跌至低於歷史常態2個標準差。目前，這一指標也已遠低於2025年11月和2026年3月出現的峯值水平，當時散戶買入規模一度達到高於過去一年平均水平3個標準差。類似的，散戶對單隻半導體股票的買入規模上個月也降至低於歷史常態2個多標準差的水平。與6月至7月芯片行業遭遇拋售之前相比，如今散戶投資者買入的半導體股票和ETF明顯減少。AI交易仍處於高度動態變化之中。