At Goldman Sachs' 2026 TMT conference, managements from TSMC, Amkor, SanDisk, Teradyne and Applied Materials said structural AI demand is driving capacity additions across wafers, advanced packaging, storage and test, with some customers' demand visibility extending to 2030. Applied Materials said customers now provide rolling eight-quarter demand forecasts and have given long-term commitments through 2030. TSMC said N3 wafer and CoWoS capacity remain tight; new fabs typically take 2–3 years to

At Goldman Sachs' 2026 TMT conference, managements from TSMC, Amkor, SanDisk, Teradyne and Applied Materials said structural AI demand is driving capacity additions across wafers, advanced packaging, storage and test, with some customers' demand visibility extending to 2030. Applied Materials said customers now provide rolling eight-quarter demand forecasts and have given long-term commitments through 2030. TSMC said N3 wafer and CoWoS capacity remain tight; new fabs typically take 2–3 years to build and require a 1–2 year production ramp. Amkor is advancing its Arizona advanced-packaging Phase II project to add about 60,000 sqm of cleanroom. SanDisk said NAND supply tightness is likely to persist through 2027 and could extend into 2028.