At its 2026 semiannual results briefing, Tianyue Advanced said rising AI compute density is increasing thermal-management pressure in advanced packaging. Silicon carbide (SiC), with high thermal conductivity and high-temperature tolerance, can be used in thermal and interposer layers to improve heat transfer, support system stability at higher power density, and in some designs balance integration density with package form. The company is deploying these advanced-packaging thermal/interposer sol

At its 2026 semiannual results briefing, Tianyue Advanced said rising AI compute density is increasing thermal-management pressure in advanced packaging. Silicon carbide (SiC), with high thermal conductivity and high-temperature tolerance, can be used in thermal and interposer layers to improve heat transfer, support system stability at higher power density, and in some designs balance integration density with package form. The company is deploying these advanced-packaging thermal/interposer solutions and is advancing cooperation with downstream customers.