Xinqi Microelectronics said at its 2026 interim results meeting that H2
deliveries of high-end PCB equipment remain full and advanced packaging tools
have moved into validation and deployment. The company expects next year's
AI-server builds, related substrates and advanced packaging capacity expansions
to drive additional equipment demand. Its Phase-II plant ramped in 1H with high
capacity utilization and is expected to reach full release in H2; modular
production and pre‑stocking of key components will support continued fulfillment
of high-end PCB and advanced packaging equipment orders.
