China’s Ministry of Industry and Information Technology and National Development
and Reform Commission issued a joint electronic information manufacturing plan
calling for accelerated development of advanced storage technologies and compute
infrastructure. Policy directs promotion of storage‑centric computing and
compute‑by‑storage, upgrades to distributed and hyperconverged storage, and the
establishment of tiered data‑storage architectures and protocols. It targets
breakthroughs in intelligent tiered storage, data sparsification, key‑value
caching and the R&D of high‑bandwidth flash, high‑bandwidth memory (HBM),
ferroelectric, resistive (ReRAM) and magnetoelectric memories. On facilities and
applications, the plan backs hyperscale intelligent‑compute architecture to
support AI clusters at the scale of hundreds of thousands of accelerator cards,
a full‑chain buildout of space‑based computing with deeper compute‑power
co‑design, strengthened distributed edge computing architectures,
higher‑performance compilers/databases/middleware, and work on domain‑specific
accelerators and large‑scale parallel compute bottlenecks to lift Z‑class
supercomputer performance.
