As the calendar moves into late Q3, TSMC’s 3nm and 2nm process capacity and CoWoS advanced packaging remain persistently undersupplied, supply-chain sources say. NVIDIA and Apple continue to occupy large shares of advanced-node and packaging resources. AWS has ramped wafer starts for in-house AI chips; its Annapurna unit has secured additional 3nm capacity. MediaTek, beyond handset chips and driven by a large Google TPU-related order, is also aggressively competing for 2nm/3nm process and CoWoS-

As the calendar moves into late Q3, TSMC’s 3nm and 2nm process capacity and CoWoS advanced packaging remain persistently undersupplied, supply-chain sources say. NVIDIA and Apple continue to occupy large shares of advanced-node and packaging resources. AWS has ramped wafer starts for in-house AI chips; its Annapurna unit has secured additional 3nm capacity. MediaTek, beyond handset chips and driven by a large Google TPU-related order, is also aggressively competing for 2nm/3nm process and CoWoS-S/L capacity.