Chinese chipmakers Xinyueneng and Xinjuneng said their jointly developed second‑generation automotive‑grade silicon carbide (SiC) main‑drive chip and module combo has been integrated into vehicles. The 1400V SiC chip is optimized for high‑voltage, high‑frequency extreme onboard conditions. The partners are jointly developing a third‑generation full‑series chip, and report multiple passenger‑car OEMs have indicated intent to nominate the design for main‑drive programs. The firms achieved mass on‑

Chinese chipmakers Xinyueneng and Xinjuneng said their jointly developed second‑generation automotive‑grade silicon carbide (SiC) main‑drive chip and module combo has been integrated into vehicles. The 1400V SiC chip is optimized for high‑voltage, high‑frequency extreme onboard conditions. The partners are jointly developing a third‑generation full‑series chip, and report multiple passenger‑car OEMs have indicated intent to nominate the design for main‑drive programs. The firms achieved mass on‑vehicle fitment of their first‑generation SiC chip in mid‑2025.