住友商事：已將持有的泰國燃氣發電業務部分股權出售給四國電力。

TrendForce says as GPU vendors and hyperscale cloud providers develop more powerful, feature-rich AI chips, 2.5D packaging development is focusing on larger package area. TSMC’s CoWoS-L faces competition from Intel’s EMIB-T but, due to greater maturity and yield advantages, is expected to remain the mainstream AI chip packaging solution through 2028.

Sept 18 — Foreign Ministry spokesman Guo Jiakun said at a regular briefing that specific queries should be directed to the relevant Chinese authorities. He stressed China-EU economic ties are mutually beneficial, not a zero-sum contest, and urged open cooperation and equal dialogue to resolve trade disputes; he added China’s EV sector supplies high-quality, cost-competitive products and contributes to the global low-carbon transition.