TrendForce says AI server demand is expanding and HBM and conventional DRAM are competing for limited advanced-node process and wafer capacity. Yield and output improvements for next‑generation products will take time, leaving memory supply tight through 2027. Suppliers are increasingly willing to lift HBM prices; TrendForce has raised its 2027 HBM outlook and now forecasts blended ASP to rise 121% YoY, driven by sustained supply tightness, a larger share of premium-priced HBM4 and HBM4e ramping

TrendForce says AI server demand is expanding and HBM and conventional DRAM are competing for limited advanced-node process and wafer capacity. Yield and output improvements for next‑generation products will take time, leaving memory supply tight through 2027. Suppliers are increasingly willing to lift HBM prices; TrendForce has raised its 2027 HBM outlook and now forecasts blended ASP to rise 121% YoY, driven by sustained supply tightness, a larger share of premium-priced HBM4 and HBM4e ramping from H2 2027.