Korean Economic Daily reported Samsung Electronics' next‑generation 12‑layer
HBM4E high‑bandwidth memory has passed customer quality validation by NVIDIA and
major hyperscale data center operators under client test specifications. The
report says only qualification status is confirmed; customer supply volumes,
contract sizes and mass‑production start dates remain unverified. Industry
participants say as the sector transitions to next‑generation products, Samsung
could expand supply opportunities ahead of SK Hynix and Micron in the
high‑performance AI memory market.