People familiar with the matter told foreign media Tencent told fixed-income investors on Monday it plans to issue about $5bn of bonds to fund AI-related capital expenditure, with proceeds largely earmarked for chip procurement. The deal could price as soon as Tuesday and comprises $1.5–2.0bn of USD notes and 20–25bn yuan of offshore RMB (CNH) bonds, about $3.0–3.7bn. Management said net proceeds will be used for general corporate purposes, including AI capex, most of which will go toward buying

People familiar with the matter told foreign media Tencent told fixed-income investors on Monday it plans to issue about $5bn of bonds to fund AI-related capital expenditure, with proceeds largely earmarked for chip procurement. The deal could price as soon as Tuesday and comprises $1.5–2.0bn of USD notes and 20–25bn yuan of offshore RMB (CNH) bonds, about $3.0–3.7bn. Management said net proceeds will be used for general corporate purposes, including AI capex, most of which will go toward buying chips.