At its 2026 H1 results briefing, Dongliyuan said it has no definitive debt-restructuring plan to date. The company is widening financing channels, tightening receivables management and accelerating cash conversion, and will continue measures to cut financing costs and operating expenses — including process upgrades and supplier price negotiations. It said it expects to ease debt pressure and improve funding conditions through additional financing and better operating performance.

iFlytek will unveil Xinghuo X2.6 and a new cloud+edge collaboration solution based on fully domestic compute at the iFlytek Global 1024 Developers Festival on Oct. 22. The company says the solution will enable more on-device processing while routing complex workloads to edge-cloud coordination. The main forum begins at 14:00 at Phase II of the Beijing National Convention Center. iFlytek will also present advances in intelligent voice, multimodal human–machine interaction and embodied robot multimodal interaction, demonstrate integrated software‑hardware applications including smart cockpits and AI glasses, and launch an enterprise-facing intelligent agent development and services platform.

Taiwan Semiconductor Manufacturing Co, the world’s largest contract chipmaker, said Thursday that surging demand for AI processors lifted third-quarter net profit 69% YoY to NT$763.1 billion (US$23.6 billion) for July–September, a record and above institutional estimates of NT$746.3 billion.