ZTE Executive VP and CTO Wang Xiyu said the company’s next‑generation data‑center network NPO is being positioned as an improved solution for AI Fabric, targeting node‑internal interconnects as the primary use case. He highlighted a trend of optical components converging toward electrical chips and described NPO as balancing openness, cost and maintainability to lead high‑density bandwidth evolution. On spaceborne links, ZTE is advancing commercial validation of 100G/200G onboard products; 400G/

ZTE Executive VP and CTO Wang Xiyu said the company’s next‑generation data‑center network NPO is being positioned as an improved solution for AI Fabric, targeting node‑internal interconnects as the primary use case. He highlighted a trend of optical components converging toward electrical chips and described NPO as balancing openness, cost and maintainability to lead high‑density bandwidth evolution. On spaceborne links, ZTE is advancing commercial validation of 100G/200G onboard products; 400G/800G core chips and optical devices are in validation to support long‑term evolution of satellite laser communications. Product designs will allow laser and routing functions to be combined or separated to fit different satellite platforms, and integrated space‑ground high‑value applications are being deployed.