Samsung Electro‑Mechanics said on the 19th it has signed a long-term supply
contract with a global major customer for memory semiconductor packaging
substrates worth about 360.5 billion won. The deal brings the company’s
cumulative long-term contract wins over the past five months to more than 4
trillion won. Packaging substrates, which connect chips to mainboards and enable
high-speed signal transmission, require high-density and fine-circuit
manufacturing for high-performance semiconductors. The contract expands Samsung
Electro‑Mechanics’ component business: alongside laminated ceramic and silicon
capacitors, the company has now secured large orders in packaging solutions.