The 24th China Semiconductor Packaging & Test Technology and Market Annual
Conference will be held Nov 4-6 at Fengda International Hotel, Nanjing. Leading
listed firms including Huatian Technology, Changdian Technology, Tongfu
Microelectronics, Nanjing TSMC, Biren Technology, BOE and Yuntian Semiconductor
— alongside players in chip design, glass substrates and advanced-packaging
equipment — will present at the main forum, technical reports and supply-demand
sessions. Organizers emphasize that with Moore’s Law nearing physical limits and
rapid AI compute growth, advanced packaging and test technologies are evolving
into a strategic growth area that supports chip performance gains and industry
innovation.
