Samsung Electronics chairman Lee Jae‑yong visited the Advanced Packaging Lab (APL) in Yokohama on the 1st to review next‑generation semiconductor packaging materials and process R&D and to discuss deeper cooperation with Japanese materials, parts and equipment suppliers. Samsung established the Yokohama APL in 2023 and plans to invest ¥40 billion over five years from 2024 (about $254 mln) to develop it as a global advanced‑packaging R&D centre, expand local R&D headcount to over 100 by 2027, and

Samsung Electronics chairman Lee Jae‑yong visited the Advanced Packaging Lab (APL) in Yokohama on the 1st to review next‑generation semiconductor packaging materials and process R&D and to discuss deeper cooperation with Japanese materials, parts and equipment suppliers. Samsung established the Yokohama APL in 2023 and plans to invest ¥40 billion over five years from 2024 (about $254 mln) to develop it as a global advanced‑packaging R&D centre, expand local R&D headcount to over 100 by 2027, and broaden research into wafer bonding, glass substrates and other next‑generation packaging technologies.