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2026-07-04

An Egyptian minister said Egypt expects to receive €1.5 bln under the EU aid package within days.

An Egyptian minister said Egypt expects to receive €1.5 bln under the EU aid package within days.
2026-07-04

埃及相關部長透露,埃及預計將在未來幾天內收到歐盟援助方案項下的15億歐元資金。

埃及相關部長透露,埃及預計將在未來幾天內收到歐盟援助方案項下的15億歐元資金。
2026-07-04

UK Prime Minister Starmer and French President Macron said on 3 July they will work with Oman to safeguard sovereign territorial waters. Iran deputy foreign minister Gharibabadi on 4 July responded that the Strait of Hormuz is not a venue for extra‑regional military displays and Tehran opposes any military action that could affect the waterway’s security. He said Iran, as a guarantor of Strait security, will monitor related military moves closely, that security should be maintained by littoral s

UK Prime Minister Starmer and French President Macron said on 3 July they will work with Oman to safeguard sovereign territorial waters. Iran deputy foreign minister Gharibabadi on 4 July responded that the Strait of Hormuz is not a venue for extra‑regional military displays and Tehran opposes any military action that could affect the waterway’s security. He said Iran, as a guarantor of Strait security, will monitor related military moves closely, that security should be maintained by littoral states, and that any party creating a crisis will bear the consequences; the warning was described as “serious.”
2026-07-04

Mali's military said the situation was 'fully under control' after insurgent attacks on five cities and towns.

Mali's military said the situation was 'fully under control' after insurgent attacks on five cities and towns.
2026-07-04

馬裏軍方表示,在五個城市和城鎮遭遇叛亂襲擊後,局勢“完全可控”。

馬裏軍方表示,在五個城市和城鎮遭遇叛亂襲擊後,局勢“完全可控”。
2026-07-04

一、SK海力士 1. 清州M15X(DRAM / HBM關鍵產能) 預計出貨節奏:2026年起逐步貢獻HBM相關供給;2026–2027年成爲AI DRAM增量核心來源之一。 2. 龍仁半導體集羣(Yongin Cluster) 預計出貨節奏:2027首座Fab進入產出階段;2028–2030多Fab連續擴產;2030+全面規模化HBM與先進DRAM基地。 3. 美國印第安納州 HBM 封裝基地 預計出貨節奏:2027–2028封裝產能逐步形成;2028開始規模化支持HBM出貨。 二、三星電子 1. 平澤 P4 / P5 產線羣(核心DRAM與HBM) 預計出貨節奏:2027部分試產與導入客戶驗證;2028規模量產階段。 2. HBM專用產能擴張(Cheonan / Onyang) 預計出貨節奏:2027–2028進入HBM4量產窗口。 三、美光 1. 美國愛達荷州 / 紐約州(先進DRAM基地) 預計出貨節奏:2027中後開始初始晶圓輸出;2028+進入規模化供貨。 2. 新加坡NAND + DRAM混合擴產 預計出貨節奏:2027年HBM/NAND相關擴產開始貢獻產出;

一、SK海力士 1. 清州M15X(DRAM / HBM關鍵產能) 預計出貨節奏:2026年起逐步貢獻HBM相關供給;2026–2027年成爲AI DRAM增量核心來源之一。 2. 龍仁半導體集羣(Yongin Cluster) 預計出貨節奏:2027首座Fab進入產出階段;2028–2030多Fab連續擴產;2030+全面規模化HBM與先進DRAM基地。 3. 美國印第安納州 HBM 封裝基地 預計出貨節奏:2027–2028封裝產能逐步形成;2028開始規模化支持HBM出貨。 二、三星電子 1. 平澤 P4 / P5 產線羣(核心DRAM與HBM) 預計出貨節奏:2027部分試產與導入客戶驗證;2028規模量產階段。 2. HBM專用產能擴張(Cheonan / Onyang) 預計出貨節奏:2027–2028進入HBM4量產窗口。 三、美光 1. 美國愛達荷州 / 紐約州(先進DRAM基地) 預計出貨節奏:2027中後開始初始晶圓輸出;2028+進入規模化供貨。 2. 新加坡NAND + DRAM混合擴產 預計出貨節奏:2027年HBM/NAND相關擴產開始貢獻產出;2028進入穩定出貨週期。 總結:從擴產情況來看,2027三家擴產開始“逐步兌現”,但結構性缺口仍在。HBM 供應仍然會是瓶頸。2028年開始新一輪HBM與DRAM產能將集中釋放,價格週期可能進入再平衡階段。
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