1. Tsinghua University team breaks through the bottleneck of next-generation magnetic storage technology: chiral antiferromagnetism enables efficient electrical control. 2. Huawei showcases its fully liquid-cooled AI supernode overseas for the first

2026-03-03

1. Tsinghua University team breaks through the bottleneck of next-generation magnetic storage technology: chiral antiferromagnetism enables efficient electrical control. 2. Huawei showcases its fully liquid-cooled AI supernode overseas for the first time. 3. Samsung introduces a new power supply architecture to reduce HBM defect rates. 4. AI inference chips open up market space; PCB supply chain price increases may continue. 5. SmartSens issues price increase notice: starting March 1st, prices for smart security and AIoT products will increase by 10% to 20%. 6. Lu Weibing discusses memory price increases: unprecedented, expected to continue until the end of 2027; currently, Xiaomi is not facing shortages. 7. ASR Microelectronics: The company's main cellular IoT products are generally not significantly affected by memory price increases. 8. Nvidia plans to invest $2 billion each in two optical companies to strengthen its AI computing power ecosystem. 9. Reports indicate that ASML plans to expand its chip manufacturing equipment into the advanced packaging field.