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Taiwan Stock Exchange: Despite increased global uncertainty and market volatility, the Taiwan stock market has demonstrated resilience, supported by sound corporate fundamentals, strong economic momentum, and ample market liquidity.

2026-03-09

Taiwan Stock Exchange: Despite increased global uncertainty and market volatility, the Taiwan stock market has demonstrated resilience, supported by sound corporate fundamentals, strong economic momentum, and ample market liquidity.

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2026-03-09

Israeli Chief of Staff: This battle will last a long time. This is a war of our generation, crucial and decisive. It will determine our future security.

Israeli Chief of Staff: This battle will last a long time. This is a war of our generation, crucial and decisive. It will determine our future security.
2026-03-09

1. Reports indicate that Nvidia's Vera Rubin chip only uses HBM4 technology from Samsung and SK Hynix. 2. Jensen Huang: Supply chain shortages, including memory chips, are good news for Nvidia. 3. Rumors of mobile phone price increases are drawing

1. Reports indicate that Nvidia's Vera Rubin chip only uses HBM4 technology from Samsung and SK Hynix. 2. Jensen Huang: Supply chain shortages, including memory chips, are good news for Nvidia. 3. Rumors of mobile phone price increases are drawing attention; several stores in Hangzhou say they have not yet received any notification. 4. Biwin Storage: Memory product market prices rose sharply in the first quarter, but future price trends remain uncertain. 5. Longsys: Has established deep and multi-faceted cooperative relationships with major global memory wafer manufacturers and signed long-term supply agreements or memorandums of understanding. 6. AMEC launches its new generation CMS32F040 series 32-bit microcontrollers. 7. Wang Teng: Memory prices will continue to rise in the second quarter; the mobile phone industry estimates a wave of large-scale layoffs this year. 8. The industry is considering further relaxing future HBM memory height restrictions, potentially delaying the adoption of hybrid bonding. 9. Ansteel Technology: High-purity tungsten/molybdenum sputtering targets and other materials can be applied to key processes in memory chip manufacturing. 10. Nanya Technology: The supply-demand imbalance in DRAM memory is not expected to gradually improve until the second half of 2028 at the earliest.
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