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TENCENT GRANT OF OPTIONS PURSUANT TO SHARE OPTION SCHEME
2026-03-25
TENCENT GRANT OF OPTIONS PURSUANT TO SHARE OPTION SCHEME
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2026-03-25
1. Shenzhen: Accelerating research and development of advanced packaging technologies for memory chips, focusing on high-end storage products such as enterprise-grade SSDs and enterprise-grade memory modules. 2. Xiaomi responds to memory price incre
1. Shenzhen: Accelerating research and development of advanced packaging technologies for memory chips, focusing on high-end storage products such as enterprise-grade SSDs and enterprise-grade memory modules. 2. Xiaomi responds to memory price increases: It will exacerbate the reshaping of the industry landscape, and future price increases are possible. 3. SK Hynix plans to spend $8 billion to acquire top-tier ASML chip manufacturing equipment. 4. South Korean media: SK Hynix plans to raise approximately $10 billion through a US IPO. 5. Biwin Storage: Signed a routine operational procurement contract with a memory manufacturer, with a total committed procurement amount of $1.5 billion. 6. Beijing Junzheng: Supply of automotive-grade and industrial storage is tight, with strong customer demand. 7. ASUS's Liao Yixiang: Confirms that ASUS PCs will increase in price by 25-30% or more in the second quarter. 8. Naura Technology Group releases a new generation 12-inch NMC612H inductively coupled plasma (ICP) etching equipment. 9. The super boom cycle for memory chips continues, with price increases sweeping across the entire consumer electronics industry chain. 10. Morgan Stanley: Soaring memory costs drag down Android; Apple may become the biggest winner in this year's mobile phone market.
2026-03-25
KENYA FINALISED A TRADE DEAL WITH CHINA THIS WEEK, PRESIDENT RUTO SAYS
KENYA FINALISED A TRADE DEAL WITH CHINA THIS WEEK, PRESIDENT RUTO SAYS
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