1. South Korean chip giants increase investment in China: Samsung upgrades processes at its Xi'an factory, and SK Hynix increases capacity at its two major factories.
2. Micron plans to develop stacked GDDR technology, with prototypes expected to launch in 2027.
3. "Father of HBM": AI will be memory-centric, GPUs may become ordinary components.
4. Reports indicate Micron is attempting vertically stacked GDDR memory: paving a new path between standard GDDR and HBM.
5. Kioxia announces gradual withdrawal from 2D NAND and third-generation BiCS FLASH products, with shipments delayed until the end of 2028.
6. Institutions: Spot trading pressures low-end resources, channel prices for low-capacity DDR4 memory modules fall by over 20%.
7. Reports indicate TSMC's 3nm capacity is critically low, with Samsung's 2nm becoming the only global alternative.
8. Demingli: Q1 net profit is expected to be 3.15 billion to 3.65 billion yuan, with memory prices continuing to rise.
9. Institution: AI server demand supports rising memory contract prices in Q2 2026; CSPs lock in supply through long-term agreements.
10. Chengbang Technology: Plans to raise no more than 100 million yuan through private placement for embedded memory chip capacity expansion projects, etc.
