Taiwan Semiconductor Manufacturing Co. said it will not deploy ASML Holding NV’s
high-NA EUV lithography machines for production before 2029, citing costs
exceeding €350 million per unit. Deputy Co-COO Kevin Zhang said existing EUV
tools remain sufficient and describe the new systems as “very, very expensive.”
TSMC plans to begin A13 chip production in 2029. The decision may weigh on
ASML’s outlook, as it targets broader adoption of the technology by 2027–2028.
TSMC continues heavy capital spending while maintaining strong margin
expectations.
