1. Strong demand for memory chips drives SK Hynix's quarterly profit up 406%.
2. SK Hynix plans to achieve mass production of its next-generation high-bandwidth memory chip, HBM4E, by 2027.
3. Strong server demand supports a robust memory market; SK Hynix anticipates continued tight supply-demand balance and a potentially prolonged price cycle.
4. SK Hynix holds groundbreaking ceremony for its P&T7 advanced packaging facility, which will be used for manufacturing HBM and other components.
5. Tesla CEO Elon Musk predicts a severe shortage of AI chips in the future.
6. TSMC showcases next-generation chip technology, aiming to bypass ASML's expensive new equipment.
7. Retail prices for finished memory products continue to decline; channel SSD and memory module prices have fallen again.
8. Kioxia releases its first BiCS8 QLC client SSD, targeting PC OEMs.
9. Rambus launches LPDDR SOCAMM2 memory module chipset solution.
10. Powerchip Technology: It is collaborating with Micron to develop 1P process DRAM memory, with mass production expected in the second half of 2028.
