HONG KONG TO ISSUE US$500M OF INFRASTRUCTURE NOTES WITH 5-YEAR TENOR
HONG KONG INFRASTRUCTURE NOTES CARRY 4% COUPON, MATURE MAY 2031
HONG KONG BOND ISSUANCE PROCEEDS TO BE USED TO FINANCE INFRA PROJECTS, TERM
SHEET SHOWS
2026-05-11
HONG KONG TO ISSUE US$500M OF INFRASTRUCTURE NOTES WITH 5-YEAR TENOR
HONG KONG INFRASTRUCTURE NOTES CARRY 4% COUPON, MATURE MAY 2031
HONG KONG BOND ISSUANCE PROCEEDS TO BE USED TO FINANCE INFRA PROJECTS, TERM
SHEET SHOWS