HONG KONG TO ISSUE US$500M OF INFRASTRUCTURE NOTES WITH 5-YEAR TENOR HONG KONG INFRASTRUCTURE NOTES CARRY 4% COUPON, MATURE MAY 2031 HONG KONG BOND ISSUANCE PROCEEDS TO BE USED TO FINANCE INFRA PROJECTS, TERM SHEET SHOWS

2026-05-11

HONG KONG TO ISSUE US$500M OF INFRASTRUCTURE NOTES WITH 5-YEAR TENOR HONG KONG INFRASTRUCTURE NOTES CARRY 4% COUPON, MATURE MAY 2031 HONG KONG BOND ISSUANCE PROCEEDS TO BE USED TO FINANCE INFRA PROJECTS, TERM SHEET SHOWS