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Saudi Aramco CEO Nasser: This impact was partially offset by alternative shipping routes that bypass the Strait of Hormuz and the release of strategic reserves.

2026-05-11

Saudi Aramco CEO Nasser: This impact was partially offset by alternative shipping routes that bypass the Strait of Hormuz and the release of strategic reserves.

Other News
2026-05-11

HUNGARY'S NOMINEE FOR FOREIGN MINISTER ANITA ORBAN: THE US WILL REMAIN AN IMPORTANT PARTNER IN SECURITY AND ECONOMY AS WELL

HUNGARY'S NOMINEE FOR FOREIGN MINISTER ANITA ORBAN: THE US WILL REMAIN AN IMPORTANT PARTNER IN SECURITY AND ECONOMY AS WELL
2026-05-11

Key News 1. Iran stated that its negotiation priorities are ending the war and ensuring maritime security. 2. Iran stated it will make a decision on issues such as uranium enrichment at an appropriate time. 3. Britain and France will hold a meetin

Key News 1. Iran stated that its negotiation priorities are ending the war and ensuring maritime security. 2. Iran stated it will make a decision on issues such as uranium enrichment at an appropriate time. 3. Britain and France will hold a meeting to discuss resuming shipping in the Strait of Hormuz. 4. Zelensky: Ukraine and the US maintain diplomatic communication; a prisoner exchange plan between Ukraine and Russia is under negotiation. Stock News 1. Intel (INTC.O) CEO Chen Liwu stated that they are collaborating with Nvidia to develop new products, which market predictions suggest may be related to system-on-a-chip (SoC) for data centers. 2. Amazon (AMZN.O) is preparing to issue its first Swiss franc bond to support its AI strategy. 3. Alphabet (GOOG.O) has submitted applications for five tranches of yen-denominated notes; the specific size was not disclosed. 4. Lumentum (LITE.O) shares rose more than 5% in pre-market trading; the company will be included in the Nasdaq 100 index starting May 18. 5. SoftBank Group is reportedly in talks to build a multi-billion dollar data center in France, with the deal potentially announced this month. 6. Intel (INTC.O) is reportedly collaborating with SK Hynix to advance EMIB-based 2.5D advanced packaging technology. This technology connects multiple chips via silicon bridges, potentially alleviating bottlenecks in advanced process technology production capacity.
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