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1. Yangtze Memory Technologies Co., Ltd. (YMTC) initiates IPO preparation. 2. Samsung's HBM3E and HBM4 DRAM yields improve. 3. Huada Jiutian: Products are already being widely used in the design and manufacturing of memory chips. 4. AMD releases d

2026-05-20

1. Yangtze Memory Technologies Co., Ltd. (YMTC) initiates IPO preparation. 2. Samsung's HBM3E and HBM4 DRAM yields improve. 3. Huada Jiutian: Products are already being widely used in the design and manufacturing of memory chips. 4. AMD releases details of its EPYC 8005 "Sorano" processor: supports 6400MT/s memory. 5. Addlink announces a series of new storage products: including memory modules, solid-state drives, and magnetic expansion docks. 6. Alibaba Cloud releases the "Zhenwu M890" AI chip and a 128-card supernode server, supporting massive agent concurrent inference. 7. ASML CEO, Fosun Fischer: The first batch of chips produced by High-NA lithography machines will be available within months. 8. ASR Microelectronics: The company's cooperation with DAP Microelectronics is a turnkey customized business, currently in the mass production and supply stage. 9. Huada Jiutian: Products are already being widely used in the design and manufacturing of memory chips.

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