The global semiconductor industry association SEMI said in its latest forecast
that, driven by rising demand from artificial intelligence (AI) and
high-performance computing (HPC), glass substrates are expected to enter early
production around 2028. SEMI said initial production will target specific
high-performance applications and only later expand into broader, more complex
semiconductor packaging structures. The association projects the glass substrate
market to grow at a 67.2% CAGR from 2028 through 2040.
