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Kurt Kelty, head of General Motors' (GM.N) battery business, stated that the company's future electric vehicles may not use low-cost lithium iron phosphate (LFP) batteries. The Tennessee plant will begin producing LFP batteries this month for energy

2026-06-11

Kurt Kelty, head of General Motors' (GM.N) battery business, stated that the company's future electric vehicles may not use low-cost lithium iron phosphate (LFP) batteries. The Tennessee plant will begin producing LFP batteries this month for energy storage systems, not for electric vehicles.

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2026-06-10

Ukrainian President Zelensky: Since the beginning of this week, 11 of our regions have been attacked. In less than three days, Russia has used nearly 530 drones and two missiles to strike Ukraine.

Ukrainian President Zelensky: Since the beginning of this week, 11 of our regions have been attacked. In less than three days, Russia has used nearly 530 drones and two missiles to strike Ukraine.
2026-06-10

1. Biwin Memory: The company signed a contract with a memory chip manufacturer, with a total committed purchase amount of US$1.861 billion. 2. Overseas inventories will only last until the end of June, bringing a "golden window" for domestic tungste

1. Biwin Memory: The company signed a contract with a memory chip manufacturer, with a total committed purchase amount of US$1.861 billion. 2. Overseas inventories will only last until the end of June, bringing a "golden window" for domestic tungsten hexafluoride production. 3. Institutions: Under pressure from memory chip costs, total smartphone production is projected to decrease by 16.2% year-on-year in 2026. 4. Samsung and SK Hynix are reportedly about to announce investment plans in South Korea. 5. Semiconductor inventories are rebounding; institutions: sales growth is far outpacing inventory growth, and the entire AI industry chain is still in a rapid expansion phase. 6. Institutions: Under pressure from memory chip costs, total smartphone production is projected to decrease by 16.2% year-on-year in 2026. 7. SK Hynix has introduced additional equipment to its P&T6 plant to meet HBM4 packaging and testing needs. 8. SanDisk is about to launch 4TB/8TB versions of its SDUC memory cards, which are incompatible with existing card readers. 9. Montage Technology successfully sampled a 9200 MT/s DDR5 RCD chip. 10. Jingzhi Technology: Semiconductor testing equipment benefits from the demand for advanced packaging and HBM; some production lines have replaced foreign suppliers as the main suppliers for certain production lines.
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