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TSMC has circulated a 'CoWoS glass-substrate development plan' to its supply chain, naming ABF substrate maker Ibiden and panelmaker Innolux to jointly validate the feasibility of introducing glass substrates into CoWoS advanced packaging. TSMC says

2026-06-16

TSMC has circulated a 'CoWoS glass-substrate development plan' to its supply chain, naming ABF substrate maker Ibiden and panelmaker Innolux to jointly validate the feasibility of introducing glass substrates into CoWoS advanced packaging. TSMC says this is its first public disclosure of glass-substrate technical progress and indicates the technology has entered industrial verification. The company cautioned glass substrates remain some way from full mass production and further R&D is required on glass thickness and large-format CoWoS package layouts.

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2026-06-16

[Futures Hotspot Tracking] LME copper prices fluctuated lower, with uncertainties in the Middle East and other factors putting pressure on market sentiment. Where are the key points of the fundamental game in the copper market?

[Futures Hotspot Tracking] LME copper prices fluctuated lower, with uncertainties in the Middle East and other factors putting pressure on market sentiment. Where are the key points of the fundamental game in the copper market?
2026-06-16

China Central Depository & Clearing Co., Ltd. (CCDC) publicly solicited opinions on further reducing settlement service fees for market makers, and decided to further reduce the settlement service fee for spot bond transactions completed through mark

China Central Depository & Clearing Co., Ltd. (CCDC) publicly solicited opinions on further reducing settlement service fees for market makers, and decided to further reduce the settlement service fee for spot bond transactions completed through market making from 20% to 25%.
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