1. Institutional reports: Contract prices rose by over 100% in the first half of the year; structural shortages in the second half will drive continued price increases for NOR Flash and SLC NAND.
2. Reports indicate TSMC has released its glass substrate development plan to its supply chain, publicly disclosing its technological progress for the first time.
3. SK Hynix is rumored to be planning a 100 trillion won shareholder return plan; the company has responded that it has never discussed such a specific scale.
4. Samsung's MPW service may expand to 2nm in 2027.
5. Samsung Electronics is advancing the development of a "data sharing ecosystem platform," laying the foundation for unmanned wafer fabs.
6. On-site investigation in Huaqiangbei: MLCC price increases are currently concentrated in the high-end sector, while delivery cycles for mid-to-low capacitance products are lengthening.
7. Affected by tight supply of related resources, LPDDR5X/4X and channel DDR5 prices have increased across the board.
8. TrendForce: Contract prices rose by over 100% in the first half of the year; structural shortages in the second half of 2026 will drive continued price increases for NOR Flash and SLC NAND. 9. Bernstein: Kioxia's stock price is overvalued by 50%; NAND flash memory prices are expected to peak in 2027.
10. Stik: A wholly-owned subsidiary plans to invest 565 million yuan to build a high-end MLCC release film project with an annual production capacity of 1.2 billion square meters.
11. Japanese chip company Rapidus has reached a cooperation agreement with two semiconductor institutions in the UK and Italy.
12. Dongxin Semiconductor: 1xnm flash memory products have achieved mass production and sales.
