Lehman Optoelectronics said its MIP (MicroLED-in-Package) technology is primarily for packaging LED display panels, is not a wafer-level integration technology, and cannot be used for semiconductor chip packaging.

2026-06-18

Lehman Optoelectronics said its MIP (MicroLED-in-Package) technology is primarily for packaging LED display panels, is not a wafer-level integration technology, and cannot be used for semiconductor chip packaging.