Lehman Optoelectronics said its MIP (MicroLED-in-Package) technology is
primarily for packaging LED display panels, is not a wafer-level integration
technology, and cannot be used for semiconductor chip packaging.
2026-06-18
Lehman Optoelectronics said its MIP (MicroLED-in-Package) technology is
primarily for packaging LED display panels, is not a wafer-level integration
technology, and cannot be used for semiconductor chip packaging.