Shanghai Chaosilicon said it began volume production in May and shipped 12‑inch
square silicon wafers to a major customer for use in next‑generation CoPoS
advanced packaging for AI/HPC chips.
2026-06-22
Shanghai Chaosilicon said it began volume production in May and shipped 12‑inch
square silicon wafers to a major customer for use in next‑generation CoPoS
advanced packaging for AI/HPC chips.