Morgan Stanley estimates 2027 shipments of AMD EPYC Venice at 6.75 mln chips versus 5.75 mln for NVIDIA Vera, about 17% higher. The bank also forecasts TSMC CoWoS packaging capacity rising to 200k wafers per month by 2027 and says NVIDIA remains TSMC

2026-06-26

Morgan Stanley estimates 2027 shipments of AMD EPYC Venice at 6.75 mln chips versus 5.75 mln for NVIDIA Vera, about 17% higher. The bank also forecasts TSMC CoWoS packaging capacity rising to 200k wafers per month by 2027 and says NVIDIA remains TSMC’s largest advanced-packaging customer.