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Shengmei Semiconductor Equipment (Shanghai) Co., Ltd. said it has begun mass production and batch delivery of ECP plating equipment totaling 2,000 chambers as of June 2026. The company placed its first Ultra ECP AP device for advanced packaging custo

2026-07-02

Shengmei Semiconductor Equipment (Shanghai) Co., Ltd. said it has begun mass production and batch delivery of ECP plating equipment totaling 2,000 chambers as of June 2026. The company placed its first Ultra ECP AP device for advanced packaging customer validation in 2017, entered front‑end IC manufacturing in 2019, surpassed 500 chambers delivered in 2022 and 1,500 chambers in 2025.

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2026-07-02

The US Treasury auction for the 8 weeks ending July 2nd yielded a winning bid of 3.65%, compared to 3.66% previously.

The US Treasury auction for the 8 weeks ending July 2nd yielded a winning bid of 3.65%, compared to 3.66% previously.
2026-07-02

White House National Economic Council Director Hassett: US labor market remains on an upward trend.

White House National Economic Council Director Hassett: US labor market remains on an upward trend.
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